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High Power
Electronics Cooling
Data Sheet
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High Power Electronics Cooling
The military, automotive and industrial market demand has grown for high-power electronics applications such as
hybrid & electric vehicles, high power military applications, motor controls, buss converters and other devices.
High-power electronics are challenged by high heat flux and the need to reject large amounts of heat in high
temperature ambient conditions in order to maintain device temperatures. This in turn has driven up coolant flow
rates, power consumption and heat exchanger size.
RINI Technologies has developed a patented evaporative spray cooling approach to meet this challenge head-on,
providing thermal management far superior to the standard single-phase cooling techniques used today. Using a
two-phase cooling approach increases cooling efficiency allowing for high power density along with high coolant
temperatures (100ºC). Because of this, the cooling loop can be integrated with the vehicle cooling systems, improving
the Size Weight and Power (SWaP) performance.
BENEFITS:
- 3X to 5X increased inverter power density and specific power
- Enables full power module operation with 100ºC coolant
- Easily integrated into power inverter packaging and existing cooling loops
- Low coolant flow rates
APPLICATIONS:
- Hybrid & Fuel Cell Electric Vehicles
- High Power Military Applications
- DC to DC Converters
- DC to AC Inverters
- High Frequency Switching
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